Postdoctoral Research Associate
University of Illinois at Urbana-Champaign
Biological systems are soft, elastic and curved; silicon wafers are rigid, brittle and flat. Semiconductor technologies that bridge this gap in mechanics and form will create new opportunities in bio-inspired and bio-integrated systems. This talk describes mechanical design methods for developing unconventional forms of silicon electronics that offer the performance of traditional wafer-based devices but that can be bent, twisted, and stretched. The underlying mechanics in design, micro-fabrication and transfer printing approaches is discussed in details. These ideas are demonstrated with bio-inspired systems and bio-integrated, ‘tissue-like’ electronics that has unique capabilities in cardiac electrophysiology, human-machine interfaces, and continuous health monitors.
Shuodao Wang received his Bachelor’s degree in Engineering Mechanics from Tsinghua University in China (2007) and his Ph.D. degree in Mechanical Engineering from Northwestern University (2012). He is currently working with Professor John Rogers at the University of Illinois at Urbana-Champaign as a postdoctoral research associate. He has research experience in the mechanics and fabrication of stretchable and curvilinear electronics, transfer printing and thermal-mechanical responsive smart devices. His research interests include experimental and theoretical aspects of solid mechanics and their applications in micro-electronics, soft robotics, and bio-integrated systems.
Monday, March 10, 2014
132 Fluor Daniel Building
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